This week, Mediatek released its newest System-on-chip ( SoC ) line under the name “Dimensity”. The first product to be introduced from the series was the SoC Dimensity 1000. Chip Dimensity 1000 becomes the first 5G chipset in the world, which is claimed to be power efficient and supports dual-sim on 5G networks.
According to Mediatek President Joe Chen, the Dimensity line was presented as a Mediatek innovation to drive the development of 5G. “We chose the dimension as a name to show how our 5G solutions are driving new waves of innovation and experience, such as the fifth dimension in fairy tales,” Chen said
Dimensity 1000 is equipped with an eight core processor, consisting of four ARM Cortex-A77 cores with a maximum clock speed of 2.6 GHz and four ARM Cortex-A55 cores with a maximum clock speed of 2 GHz, paired with an ARM Mali-G77 graphics processor (GPU).
There is also an AI performance processor (APU) version 3.0 which is claimed to be able to produce a significant performance boost of 4.5 TOPS. In terms of connectivity, the SoC 5G Dimensity 1000 supports two 5G carrier aggregations (2CC CA) and offers downlink speeds of up to 4.7 Gbps and uplink to 2.5 Gbps on sub-6 GHz networks, both stand alone (SA) and non-stand alone (NSA).
This SoC also has multi-mode support for all generations of cellular connectivity ranging from 2G to 5G. Dimensity 1000 is processed with 7 nanometer (nm) fabrication technology and already supports the latest wireless connectivity, such as WiFi 6 and Bluetooth 5.1. For availability, the latest 5G SoC is said to be present in a number of devices in the first quarter of 2020. However, it is not mentioned who the smartphone vendor will carry.